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SSM6K781G - Toshiba

Description: N-ch MOSFET, 12 V, 7.0 A, 0.018 Ω@4.5V, WCSP6C

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PCB Footprints
SSM6K781G - Toshiba PCB footprint - BGA - BGA - WCSP6C
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3D Models
SSM6K781G - Toshiba  - 3D model - BGA - WCSP6C
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SSM6K781G Details

  • Manufacturer Part Number:

    SSM6K781G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    30

SSM6K781G Frequently Asked Questions (FAQs)

  • Toshiba recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Toshiba recommends derating the power dissipation according to the ambient temperature. For example, at 85°C, the maximum power dissipation should be limited to 1.5W. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below 150°C.
  • The maximum allowed voltage on the input pins is 6V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 2.7V to 5.5V.
  • Yes, the SSM6K781G is suitable for switching regulator applications due to its low dropout voltage and high current capability. However, ensure that the device is properly bypassed and decoupled to minimize noise and oscillations.
  • The output voltage tolerance can be calculated by adding the tolerance of the internal reference voltage (±1%) to the tolerance of the resistor divider network. For example, if the resistor divider network has a tolerance of ±0.5%, the total output voltage tolerance would be ±1.5%.

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