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SST11LP12-QCF - Microchip

Description: SST11LP12-QCF Microchip, RF Amplifier Power 5.8 GHz, 16-Pin WQFN

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PCB Footprints
SST11LP12-QCF - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-contact Very-thin Quad Flat No-lead (WQFN)
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3D Models
SST11LP12-QCF - Microchip  - 3D model - Quad Flat No-Lead - 16-contact Very-thin Quad Flat No-lead (WQFN)
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SST11LP12-QCF Details

  • Manufacturer Part Number:

    SST11LP12-QCF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, MO-220JWEED-4, WQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    27 dB

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    5800 MHz

  • Operating Frequency-Min:

    4900 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    3.3 V

  • RF/Microwave Device Type:

    NARROW BAND MEDIUM POWER

  • Supply Current-Max:

    400 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

SST11LP12-QCF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance-controlled lines. Avoid vias and right-angle bends in the RF path.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (TIM) to improve heat transfer. Operate the device within the recommended temperature range (-40°C to +125°C).
  • Power up the device in the following sequence: VCC, then VDD, then enable the clock signal. Ensure that the power supplies are stable and within the recommended voltage range before enabling the clock signal.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltages and clock signal integrity. Verify that the device is properly configured and that the firmware is correct. Consult the datasheet and application notes for troubleshooting guides.
  • Use a shielded enclosure or metal can to reduce EMI emissions. Keep the device away from other RF sources. Use a common-mode choke or ferrite bead to filter the power supply lines. Ensure that the PCB layout is optimized for EMI reduction.

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SST11LP12-QCF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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