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SST25VF032B-80-4I-S2AF - Microchip

Description: SST25VF032B-80-4I-S2AF, Serial-SPI Flash Memory 32Mbit, 4M x 8 bit, 6ns, 2.7V, 8-Pin, SOIC

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SST25VF032B-80-4I-S2AF - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8_2020
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SST25VF032B-80-4I-S2AF Details

  • Manufacturer Part Number:

    SST25VF032B-80-4I-S2AF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    80 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    5.275 mm

  • Memory Density:

    33554432 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.16 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    GOLD OVER NICKEL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Type:

    NOR TYPE

  • Width:

    5.275 mm

  • Write Protection:

    HARDWARE/SOFTWARE

SST25VF032B-80-4I-S2AF Frequently Asked Questions (FAQs)

  • The SST25VF032B has a minimum of 100,000 erase cycles, but the actual number of cycles may vary depending on the usage and operating conditions.
  • The hold pin (HOLD#) is an active low input that allows the device to be paused during a read or write operation. When the hold pin is asserted low, the device will pause the current operation and enter a low-power state. When the hold pin is de-asserted high, the device will resume the operation where it was paused.
  • The WP# pin is a write-protect pin that allows the device to be write-protected. When the WP# pin is asserted low, the device will prevent any write operations to the memory array. This pin can be used to prevent accidental writes or to protect sensitive data.
  • The optimal clock frequency depends on the specific application and system requirements. The SST25VF032B supports clock frequencies up to 80 MHz, but the actual frequency used should be determined based on the system's timing requirements and noise tolerance.
  • The SST25VF032B is the base part number, while the SST25VF032B-80-4I-S2AF is a specific variant with a clock frequency of 80 MHz, a package type of SOIC, and a temperature range of -40°C to 85°C. The -80-4I-S2AF suffix indicates the specific features and options for this particular part.

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SST25VF032B-80-4I-S2AF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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