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SST25VF080B-50-4I-ZCE - Microchip

Description: NOR Flash 2.7V to 3.6V 4Mbit SPI Serial Flash

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SST25VF080B-50-4I-ZCE - Microchip PCB footprint - Other - Other - XFBGA Z-Scale (2 mm x 2 mm Body), 16-bump
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SST25VF080B-50-4I-ZCE - Microchip  - 3D model - Other - XFBGA Z-Scale (2 mm x 2 mm Body), 16-bump
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SST25VF080B-50-4I-ZCE Details

  • Manufacturer Part Number:

    SST25VF080B-50-4I-ZCE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    XFBGA-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    CSP-16

  • Country Of Origin:

    Malaysia, USA

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2020-03-30

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    50 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Length:

    2 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    16

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA16,4X2,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.4 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00003 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    2 mm

  • Write Protection:

    HARDWARE/SOFTWARE

SST25VF080B-50-4I-ZCE Frequently Asked Questions (FAQs)

  • The SST25VF080B-50-4I-ZCE has a minimum of 100,000 erase cycles per sector, and a minimum of 10,000 erase cycles per device.
  • To handle page write buffer underrun errors, ensure that the write buffer is fully loaded before initiating a write operation. Also, use the Write Buffer Polling Status (WRSR) command to check the write buffer status before initiating a write operation.
  • The recommended power-up sequence is to apply VCC first, followed by VSS, and then the clock signal. This ensures that the device powers up correctly and minimizes the risk of latch-up or other power-up related issues.
  • Yes, the SST25VF080B-50-4I-ZCE is compatible with 3.3V power supplies. However, ensure that the voltage supply is within the recommended operating range of 2.7V to 3.6V to ensure reliable operation.
  • Wear leveling can be implemented using a combination of hardware and software techniques. One approach is to use a wear leveling algorithm that distributes write operations across the device, ensuring that no single sector is worn out prematurely. Additionally, using a flash file system that supports wear leveling can also help to extend the life of the device.

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SST25VF080B-50-4I-ZCE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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