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SST38VF6401-90-5C-EKE - Microchip

Description: 2.7 to 3.6V 64Mbit Parallel Advanced MPF

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SST38VF6401-90-5C-EKE - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST38VF6401-90-5C-EKE - Microchip  - 3D model - Small Outline Packages - 48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST38VF6401-90-5C-EKE Details

  • Manufacturer Part Number:

    SST38VF6401-90-5C-EKE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP1

  • Package Description:

    TSOP1-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TSOP-48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Access Time-Max:

    90 ns

  • Additional Feature:

    BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    1K

  • Number of Terminals:

    48

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Page Size:

    4 words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    4K

  • Standby Current-Max:

    0.00003 A

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    12 mm

SST38VF6401-90-5C-EKE Frequently Asked Questions (FAQs)

  • The SST38VF6401-90-5C-EKE has an operating temperature range of -40°C to +85°C.
  • The SST38VF6401-90-5C-EKE requires a power-up sequence of VCC first, then VPP, and a power-down sequence of VPP first, then VCC. This ensures proper device operation and prevents latch-up.
  • The SST38VF6401-90-5C-EKE can operate at clock frequencies up to 50 MHz, but the recommended frequency is 33 MHz for optimal performance and power consumption.
  • The HOLD pin should be tied to VCC or left floating during normal operation. The WP pin should be tied to VCC to enable write protection or left floating to disable write protection.
  • The SST38VF6401-90-5C-EKE has a minimum erase cycle endurance of 100,000 cycles, with a typical value of 200,000 cycles.

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SST38VF6401-90-5C-EKE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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