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SST39VF1601-70-4C-EKE - Microchip

Description: 2.7 to 3.6V 16Mbit Multi-Purpose Flash

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SST39VF1601-70-4C-EKE - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - ***48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST39VF1601-70-4C-EKE - Microchip  - 3D model - Small Outline Packages - ***48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST39VF1601-70-4C-EKE Details

  • Manufacturer Part Number:

    SST39VF1601-70-4C-EKE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSOP1

  • Package Description:

    12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TSOP-48

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Access Time-Max:

    70 ns

  • Additional Feature:

    BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    512

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    2K

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    12 mm

SST39VF1601-70-4C-EKE Frequently Asked Questions (FAQs)

  • The SST39VF1601-70-4C-EKE has an operating temperature range of -40°C to +85°C.
  • The POR and BOR features are automatically enabled during power-up. The device will reset when the power supply voltage falls below the POR threshold (typically 1.5V) or when the power supply voltage drops below the BOR threshold (typically 2.2V).
  • The recommended clock frequency for the SST39VF1601-70-4C-EKE is up to 50 MHz.
  • To ensure reliable write operations, use the device's built-in write-protect mechanism, and follow the recommended write cycle timing and voltage requirements.
  • The SST39VF1601-70-4C-EKE has a minimum endurance rating of 100,000 write cycles per sector.

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SST39VF1601-70-4C-EKE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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