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SST39VF1681-70-4C-EKE - Microchip

Description: 2.7 to 3.6V 16Mbit Multi-Purpose Flash

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SST39VF1681-70-4C-EKE - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - EKE 48-pin (TSOP)
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SST39VF1681-70-4C-EKE - Microchip  - 3D model - Small Outline Packages - EKE 48-pin (TSOP)
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SST39VF1681-70-4C-EKE Details

  • Manufacturer Part Number:

    SST39VF1681-70-4C-EKE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP1

  • Package Description:

    12 X 20 MM, LEAD FREE, MO-142DD, TSOP1-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TSOP-48

  • Direct Group:

    ME1018972LFG

  • Similar Group:

    ME101051105310031169YYYY

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Access Time-Max:

    70 ns

  • Additional Feature:

    BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    512

  • Number of Terminals:

    48

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    4K

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    12 mm

SST39VF1681-70-4C-EKE Frequently Asked Questions (FAQs)

  • The SST39VF1681-70-4C-EKE has an operating temperature range of -40°C to +85°C.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation. During hold, the device will tri-state its output and ignore any input signals.
  • The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and any write operations will be ignored.
  • The SST39VF1681-70-4C-EKE is a 16 Mbit flash memory device, organized as 2,097,152 words of 8 bits each.
  • The typical programming time for the SST39VF1681-70-4C-EKE is 10-15 microseconds per byte.

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SST39VF1681-70-4C-EKE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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