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SST39VF3201B-70-4C-EKE - Microchip

Description: 2.7 to 3.6V 32Mbit Multi-Purpose Flash

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SST39VF3201B-70-4C-EKE - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST39VF3201B-70-4C-EKE - Microchip  - 3D model - Small Outline Packages - 48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
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SST39VF3201B-70-4C-EKE Details

  • Manufacturer Part Number:

    SST39VF3201B-70-4C-EKE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSOP1

  • Package Description:

    12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TSOP-48

  • Country Of Origin:

    South Korea, Taiwan

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Access Time-Max:

    70 ns

  • Additional Feature:

    BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Endurance:

    10000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    33554432 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    1K

  • Number of Terminals:

    48

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.71,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    2K

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.045 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    12 mm

SST39VF3201B-70-4C-EKE Frequently Asked Questions (FAQs)

  • The SST39VF3201B-70-4C-EKE has an operating temperature range of -40°C to +85°C.
  • The device has an internal POR circuit that resets the device when power is applied. The power-up sequence should follow the recommended sequence in the datasheet to ensure proper device operation.
  • The device can be erased using the Chip Erase command (60h) or Sector Erase command (50h). The erase operation should be performed according to the datasheet's recommended procedure.
  • The device has a write protection feature that can be enabled or disabled using the Write Protect (WP) pin. The WP pin should be tied to VCC or GND according to the desired write protection state.
  • The SST39VF3201B-70-4C-EKE has a minimum of 100,000 erase cycles per sector, and a minimum of 10,000 erase cycles per device.

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SST39VF3201B-70-4C-EKE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image SST39VF3201B-70-4C-EKE Silicon Storage Technology

Flash, 2MX16, 70ns, PTSO48