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SST39VF400A-70-4I-B3KE - Microchip

Description: SST39VF400A-70-4I-B3KE, Parallel Split Gate Flash Memory, 256K x 16 bit 4Mbit, 70ns, 2.7 → 3.6 V, 48-Pin, TFBGA

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PCB Footprints
SST39VF400A-70-4I-B3KE - Microchip PCB footprint - BGA - BGA - 48-Ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm SST Package Code: B3K
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3D Models
SST39VF400A-70-4I-B3KE - Microchip  - 3D model - BGA - 48-Ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm SST Package Code: B3K
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SST39VF400A-70-4I-B3KE Details

  • Manufacturer Part Number:

    SST39VF400A-70-4I-B3KE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    BGA

  • Pin Count:

    48

  • Manufacturer Package Code:

    TFBGA-48

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Access Time-Max:

    70 ns

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    128

  • Number of Terminals:

    48

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA48,6X8,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    2K

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    6 mm

SST39VF400A-70-4I-B3KE Frequently Asked Questions (FAQs)

  • The SST39VF400A-70-4I-B3KE has an operating temperature range of -40°C to +85°C.
  • The device has a built-in POR circuit that ensures the device is in a known state after power-up. The POR circuit holds the device in reset until the power supply reaches a minimum voltage threshold (VCC(min)). After power-up, the device requires a minimum of 10ms to complete its internal initialization before it is ready for operation.
  • The recommended clock frequency for the SST39VF400A-70-4I-B3KE is up to 70 MHz.
  • The device has a write protection feature that can be enabled to prevent accidental writes to the device. Additionally, the device has a security feature that allows the user to permanently lock the device to prevent further writes. Refer to the datasheet for specific instructions on how to enable and use these features.
  • The SST39VF400A-70-4I-B3KE has a minimum of 100,000 erase/program cycles per sector and a data retention of at least 20 years at 25°C.

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SST39VF400A-70-4I-B3KE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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