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ST150-60T2MI - Vishay

Description: Tantalum Capacitors - Wet 150UF 60V 20% T2

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ST150-60T2MI - Vishay - PCB symbol
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PCB Footprints
ST150-60T2MI - Vishay PCB footprint - Other - Other - ST150-60T2MI-5
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ST150-60T2MI - Vishay - 3D model - Other - ST150-60T2MI-5
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ST150-60T2MI Details

  • Manufacturer Part Number:

    ST150-60T2MI

  • Pbfree Code:

    No

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.20

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Additional Feature:

    RIPPLE CURRENT IS MEASURED AT 85 DEG CEL

  • Capacitance:

    150 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Diameter:

    7.14 mm

  • Dielectric Material:

    TANTALUM (WET)

  • ESR:

    1100 mΩ

  • JESD-609 Code:

    e0

  • Leakage Current:

    0.002 mA

  • Length:

    16.28 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    TRAY

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    60 V

  • Ripple Current:

    702 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Shape:

    WIRE

ST150-60T2MI Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the ST150-60T2MI is a rectangular pad with dimensions of 12.7 mm x 7.62 mm, with a thermal pad in the center. The pad should be solder-mask defined (SMD) and have a non-solder-mask-defined (NSMD) thermal pad.
  • To ensure reliable soldering of the ST150-60T2MI, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum allowed thermal resistance for the ST150-60T2MI is 1.5°C/W, which is the maximum junction-to-ambient thermal resistance. This value is specified in the datasheet and should not be exceeded to ensure reliable operation.
  • The ST150-60T2MI is not suitable for use in high-humidity environments. It is recommended to use a conformal coating or potting compound to protect the device from moisture and humidity.
  • The recommended storage condition for the ST150-60T2MI is in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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ST150-60T2MI Overview

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