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ST1L05BPUR - STMicroelectronics

Description: STMICROELECTRONICS - ST1L05BPUR - LDO, ADJ, 1.22V-5.5V, 1.3A, DFN-6

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ST1L05BPUR - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN6 (3x3)
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ST1L05BPUR - STMicroelectronics  - 3D model - Small Outline No-lead - DFN6 (3x3)
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ST1L05BPUR Details

  • Manufacturer Part Number:

    ST1L05BPUR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, DFN-6

  • Pin Count:

    6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Nom:

    0.3 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    3 mm

  • Load Regulation-Max(%):

    1.2%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Output Current1-Max:

    1.3 A

  • Output Voltage1-Max:

    5 V

  • Output Voltage1-Min:

    1.22 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.13,38

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3%

  • Width:

    3 mm

ST1L05BPUR Frequently Asked Questions (FAQs)

  • A good thermal design is crucial. Ensure a large copper area on the PCB for the thermal pad, and use thermal vias to connect to the ground plane. Keep the thermal pad away from other components and avoid routing signals underneath.
  • Select an input capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. A 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric is a good starting point. Ensure the capacitor is rated for the input voltage and can handle the maximum input current.
  • A low-ESR ceramic capacitor with a value between 4.7uF to 10uF is recommended. The output capacitor should be rated for the output voltage and be able to handle the maximum output current. A 10uF X5R or X7R ceramic capacitor is a good choice.
  • Ensure the input and output capacitors are properly selected and placed close to the device. Use a low-ESR capacitor for the output, and avoid using electrolytic capacitors. Keep the PCB layout clean and avoid long traces. Add a 1uF to 10uF ceramic capacitor between the VIN and GND pins to improve stability.
  • The maximum ambient temperature for the ST1L05BPUR is 125°C. However, the device can operate up to 150°C with derating. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.

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ST1L05BPUR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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