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ST1L08SPU33R - STMicroelectronics

Description: LDO Voltage Regulators 800 mA Ultra low drop, high PSRR voltage regulator

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PCB Footprints
ST1L08SPU33R - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 (2x3 mm)
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3D Models
ST1L08SPU33R - STMicroelectronics  - 3D model - Small Outline No-lead - DFN8 (2x3 mm)
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ST1L08SPU33R Details

  • Manufacturer Part Number:

    ST1L08SPU33R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    7 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Line Regulation-Max:

    0.000561%

  • Load Regulation-Max:

    0.026367%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.8 A

  • Output Voltage1-Max:

    3.3825 V

  • Output Voltage1-Min:

    3.2175 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    2 mm

ST1L08SPU33R Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended temperature range (-40°C to 150°C). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Also, consider using a thermal shield or a heat sink with a high thermal conductivity material.
  • The recommended soldering conditions for the ST1L08SPU33R are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. Use a soldering iron with a temperature range of 200-240°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
  • Handle the device by the body, avoiding touching the pins or leads. Store the device in its original packaging or in a protective container to prevent mechanical damage. Avoid exposing the device to extreme temperatures, humidity, or physical stress during storage and shipping.
  • The ST1L08SPU33R has built-in ESD protection, but it's still important to follow proper ESD handling procedures to prevent damage. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device pins or leads, and handle the device by the body.

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ST1L08SPU33R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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