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ST1PS02BQTR - STMicroelectronics

Description: 400 mA nano-quiescent synchronous step-down converter with digital voltage selection, Power Good and AUX switch

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ST1PS02BQTR - STMicroelectronics - PCB symbol
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PCB Footprints
ST1PS02BQTR - STMicroelectronics PCB footprint - Other - Other - TQFN12 (2.0x1.7x0.55 mm)
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3D Models
ST1PS02BQTR - STMicroelectronics - 3D model - Other - TQFN12 (2.0x1.7x0.55 mm)
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ST1PS02BQTR Details

  • Manufacturer Part Number:

    ST1PS02BQTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFN-12

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2020-02-20

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.8 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-XQCC-N12

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.4 A

  • Output Voltage-Max:

    2.5 V

  • Output Voltage-Min:

    1.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.06X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    1.7 mm

ST1PS02BQTR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, ensure the input voltage is within the specified range, and configure the device according to the datasheet recommendations. Also, ensure the device is properly decoupled and bypassed.
  • To ensure EMI and EMC compliance, follow proper PCB layout and routing guidelines, use shielding and filtering where necessary, and ensure the device is properly decoupled and bypassed. Also, consider using EMI filters and shielding on the input and output lines.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly configured and powered up. Check for thermal issues, such as overheating or poor thermal conductivity. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.
  • The reliability and lifespan of the device depend on various factors, including operating conditions, temperature, and usage patterns. The device is designed to meet the reliability and lifespan expectations outlined in the datasheet, but actual performance may vary. Follow proper usage and storage guidelines to ensure optimal reliability and lifespan.

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ST1PS02BQTR Overview

Use the download button to access the ST1PS02BQTR schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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