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ST1S03PUR - STMicroelectronics

Description: STMicroelectronics, ST1S03PUR Step-Down Switching Regulator Adjustable, 6-Pin DFN

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Symbol
ST1S03PUR - STMicroelectronics - PCB symbol
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PCB Footprints
ST1S03PUR - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN6 (3x3)
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3D Models
ST1S03PUR - STMicroelectronics - 3D model - Small Outline No-lead - DFN6 (3x3)
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ST1S03PUR Details

  • Manufacturer Part Number:

    ST1S03PUR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, DFN-6

  • Pin Count:

    6

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.7

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.11,37

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1800 kHz

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ST1S03PUR Frequently Asked Questions (FAQs)

  • A good thermal design should be used to minimize thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to improve heat dissipation.
  • The device requires a proper power-up sequence to ensure correct configuration. The EN pin should be pulled high, and the VIN pin should be powered up before the VOUT pin. The device should be configured using the I2C interface after power-up.
  • The device is sensitive to electrostatic discharge (ESD). Handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat. Store the device in an anti-static bag or wrap it in anti-static material.
  • Use an oscilloscope to monitor the input and output voltages, as well as the EN and PG pins. Check the I2C communication using a logic analyzer. Verify the PCB layout and thermal design. Consult the datasheet and application notes for troubleshooting guidelines.
  • The device should be used within the recommended operating conditions. Implement redundant systems and error detection mechanisms. Perform thorough testing and validation, including environmental and reliability testing. Consult the datasheet and relevant industry standards for safety-critical applications.

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ST1S03PUR Overview

Use the download button to access the ST1S03PUR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ST1S0, or try a keyword search, such as Switching Regulator or Controllers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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