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ST1S06PU33R - STMicroelectronics

Description: Synchronous rectification with inhibit, 1.5 A, 1.5 MHz fixed or adjustable, step-down switching regulator

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ST1S06PU33R - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN6D (3x3)
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ST1S06PU33R - STMicroelectronics  - 3D model - Small Outline No-lead - DFN6D (3x3)
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ST1S06PU33R Details

  • Manufacturer Part Number:

    ST1S06PU33R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, DFN-6

  • Pin Count:

    6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.3

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    4.2 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    3.37 V

  • Output Voltage-Min:

    3.23 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.11,37

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1800 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ST1S06PU33R Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad connected to the ground plane.
  • To ensure proper biasing, connect the input voltage (VIN) to a stable DC power supply, and decouple it with a 10uF capacitor to ground. The enable pin (EN) should be connected to a logic signal or tied to VIN if not used. The output voltage (VOUT) should be decoupled with a 10uF capacitor to ground, and the output should not be loaded with a capacitor larger than 10uF.
  • The maximum input voltage that can be applied to the device is 36V, but it's recommended to keep it below 35V to ensure reliable operation and to prevent damage to the device.
  • The device has built-in overcurrent protection (OCP) and thermal shutdown (TSD) features. However, it's recommended to add external protection such as a fuse or a PTC thermistor to prevent overcurrent and overheating. Additionally, ensure good airflow around the device and avoid blocking the thermal pad.
  • The device is rated for operation up to 150°C, but it's recommended to derate the output current and input voltage as the temperature increases. Consult the datasheet for thermal derating curves and ensure good airflow around the device to prevent overheating.

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ST1S06PU33R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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