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ST1S31D-R - STMicroelectronics

Description: STMicroelectronics, ST1S31D-R Step-Down Switching Regulator 3A Adjustable 8-Pin, SOIC

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ST1S31D-R Details

  • Manufacturer Part Number:

    ST1S31D-R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT VOLTAGE IN ADJUSTABLE MODE FROM 0.8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1900 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

ST1S31D-R Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines. Ensure that the device is properly heatsinked, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink.
  • The recommended soldering conditions for the ST1S31D-R are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/second. It is essential to follow these conditions to prevent damage to the device.
  • To troubleshoot issues with the ST1S31D-R, start by checking the power supply voltage and ensuring that it is within the recommended range. Verify that the device is properly connected and that the PCB layout is correct. Use oscilloscopes or logic analyzers to debug the device's behavior and identify any issues. Consult the datasheet and application notes for troubleshooting guidelines.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB is designed with ESD protection in mind, and consider using ESD protection devices such as TVS diodes or ESD arrays. Follow proper handling and storage procedures to prevent ESD damage.

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ST1S31D-R Overview

Use the download button to access the ST1S31D-R schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ST1S3, or try a keyword search, such as Switching Regulator or Controllers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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