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ST33HTPH2032AHD1 - STMicroelectronics

Description: Flash-memory-based TPM 2.0 device with an SPI interface, QFN-32

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ST33HTPH2032AHD1 - STMicroelectronics - PCB symbol
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PCB Footprints
ST33HTPH2032AHD1 - STMicroelectronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VFQFPN32 is a 32-lead, 5 × 5 mm, 0.5 mm pitch
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ST33HTPH2032AHD1 - STMicroelectronics - 3D model - Quad Flat No-Lead - VFQFPN32 is a 32-lead, 5 × 5 mm, 0.5 mm pitch
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ST33HTPH2032AHD1 Details

  • Manufacturer Part Number:

    ST33HTPH2032AHD1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • Additional Feature:

    ALSO OPERATES AT 3.3V NOMINAL VOLATGE

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2032AHD1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the chip. Use a decoupling capacitor (e.g., 100nF) close to the VCC pin.
  • Implement a secure boot mechanism using the chip's built-in Secure Boot feature. Use a secure protocol (e.g., HTTPS) for firmware updates, and ensure the update process is authenticated and encrypted.
  • The chip has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape or thermal grease) and a heat sink if necessary. Keep the ambient temperature within the recommended range (–40°C to 85°C).
  • Use the chip's low-power modes (e.g., Sleep, Hibernate) and optimize the clock frequency and voltage scaling. Implement power gating for unused peripherals and use a low-power oscillator (e.g., 32kHz) for the system clock.
  • The chip has built-in ESD protection, but additional protection measures may be necessary. Use ESD-protected connectors and cables, and ensure the PCB design includes ESD protection diodes and resistors as needed.

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ST33HTPH2032AHD1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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