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ST7FLIT10BY0M6 - STMicroelectronics

Description: 8-bit MCU with single voltage Flash memory, data EEPROM, ADC, 5 timers, SPI

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ST7FLIT10BY0M6 - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin Plastic Small Outline Package, 300-mil Width
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ST7FLIT10BY0M6 - STMicroelectronics  - 3D model - Small Outline Packages - 16-Pin Plastic Small Outline Package, 300-mil Width
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ST7FLIT10BY0M6 Details

  • Manufacturer Part Number:

    ST7FLIT10BY0M6

  • Brand Name:

    STMicroelectronics

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16

  • Pin Count:

    16

  • HTS Code:

    8542.31.00.15

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    ST72

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    17

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.65 mm

  • Speed:

    8 MHz

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

ST7FLIT10BY0M6 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The ST7FLIT10BY0M6 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 1-10uF, and the output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10-22uF. The capacitors should be placed close to the device and connected to the correct pins (VIN and VOUT) to ensure stable operation.
  • The device should be powered up and powered down slowly (typically 1-10ms) to prevent voltage spikes and ensure proper operation. A soft-start circuit can be used to control the power-up sequence, and a power-down sequence should be implemented to prevent back-powering the device.
  • The ST7FLIT10BY0M6 has a maximum input voltage rating of 18V and a maximum input current rating of 10A. The device should not be operated outside of these ratings to prevent damage or malfunction.

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ST7FLIT10BY0M6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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