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ST7FLIT19BF1B6 - STMicroelectronics

Description: 8-BIT MCU

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ST7FLIT19BF1B6 - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 20-Pin Plastic Dual In-Line Package, 300-mil Width
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ST7FLIT19BF1B6 - STMicroelectronics  - 3D model - Dual-In-Line Packages - 20-Pin Plastic Dual In-Line Package, 300-mil Width
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ST7FLIT19BF1B6 Details

  • Manufacturer Part Number:

    ST7FLIT19BF1B6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-20

  • Pin Count:

    20

  • HTS Code:

    8542.31.00.15

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2.7V SUPPLY AT 4 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    ST72

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDIP-T20

  • JESD-609 Code:

    e3

  • Length:

    26.16 mm

  • Number of I/O Lines:

    17

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    5.33 mm

  • Speed:

    8 MHz

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

ST7FLIT19BF1B6 Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure optimal heat dissipation. A minimum of 2oz copper thickness is recommended, and thermal vias should be placed under the package to dissipate heat efficiently.
  • To ensure reliable communication, use a proper UART or SPI protocol, and ensure that the clock frequency is within the recommended range. Also, use a pull-up resistor on the reset pin to prevent unwanted resets.
  • The device requires a specific power sequencing to prevent latch-up or damage. The recommended power-up sequence is VCC, then VPP, and power-down sequence is VPP, then VCC.
  • The device has multiple power modes, including sleep and standby modes. To minimize power consumption, use the lowest power mode suitable for your application, and use the device's built-in power management features, such as clock gating and voltage scaling.
  • The device has built-in ESD protection, but it's still recommended to use external ESD protection devices, such as TVS diodes, to protect against electrostatic discharge.

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ST7FLIT19BF1B6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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