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ST890BDR - STMicroelectronics

Description: 1.2 A current limited high-side power switch with thermal shutdown

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ST890BDR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SO_2022
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ST890BDR Details

  • Manufacturer Part Number:

    ST890BDR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.05

  • Built-in Protections:

    OVER CURRENT; THERMAL

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    1.2 A

  • Output Peak Current Limit-Nom:

    1.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    10 µs

  • Turn-on Time:

    50 µs

  • Width:

    3.9 mm

ST890BDR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Use 100nF to 1uF ceramic capacitors, placed as close as possible to the device's power pins (VCC and GND). Ensure the capacitors are rated for the operating voltage and have a low ESR.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the device's status registers and error flags for diagnostic information. Consult the datasheet and application notes for troubleshooting guidelines.
  • Operating at a lower voltage may reduce the device's performance, increase power consumption, and affect its reliability. Consult the datasheet for voltage derating guidelines and ensure the device meets the required specifications.

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ST890BDR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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Part Image ST890BD STMicroelectronics

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