STA8090WGBD - STMicroelectronics

STA8090WGBD Details

• Manufacturer Part Number:

  STA8090WGBD

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  WLCSP-77

• HTS Code:

  8542.39.00.01

• Manufacturer:

  STMicroelectronics

• JESD-30 Code:

  R-XBGA-B77

• Length:

  3.861 mm

• Number of Terminals:

  77

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  UFBGA

• Package Equivalence Code:

  BGA77,9X9,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, ULTRA THIN PROFILE, FINE PITCH

• Seated Height-Max:

  0.6 mm

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1 V

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  RFCMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Width:

  3.843 mm

• uPs/uCs/Peripheral ICs Type:

  SoC