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STB32NM50N - STMicroelectronics

Description: N-channel 500 V, 100 mΩ typ., 22 A MDmesh II Power MOSFETs in D²PAK and TO-247 packages

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PCB Footprints
STB32NM50N - STMicroelectronics PCB footprint - Other - Other - D²PAK (TO-263)
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3D Models
STB32NM50N - STMicroelectronics  - 3D model - Other - D²PAK (TO-263)
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STB32NM50N Details

  • Manufacturer Part Number:

    STB32NM50N

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    340 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    22 A

  • Drain-source On Resistance-Max:

    0.13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    190 W

  • Pulsed Drain Current-Max (IDM):

    88 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STB32NM50N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STB32NM50N is -40°C to 150°C.
  • Proper thermal management is crucial for the STB32NM50N. Ensure good heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout.
  • A good PCB layout for the STB32NM50N should have a solid ground plane, wide power traces, and a decoupling capacitor close to the device. Avoid routing critical signals under the device.
  • To ensure EMC, use a shielded enclosure, minimize loop areas, and use a common mode choke or ferrite bead on the power lines. Also, follow good PCB layout practices and use a ground plane.
  • The recommended power-up sequence for the STB32NM50N is to apply the voltage supply (VCC) before the input signals. Ensure that the input signals are stable before applying the clock signal.

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STB32NM50N Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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