STB60NF06T4 footprint, schematic symbol and 3D model by STMicroelectronics

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STB60NF06T4 - STMicroelectronics PCB footprint - Other - Other - STB60NF06T4-1

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Datasheet Download Datasheet
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Part Number STB60NF06T4
Manufacturer STMicroelectronics
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - STB60NF06T4-1
Released Date Jan 19, 2021
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STB60NF06T4 Details

Manufacturer Part Number:
STB60NF06T4
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT, D2PAK-3
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
13 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
5
Avalanche Energy Rating (Eas):
360 mJ
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
60 A
Drain-source On Resistance-Max:
0.016 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
175 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
110 W
Pulsed Drain Current-Max (IDM):
240 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

STB60NF06T4 Frequently Asked Questions (FAQs)

The maximum junction temperature that the STB60NF06T4 can withstand is 150°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 125°C for reliable operation.
To calculate the power dissipation of the STB60NF06T4, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance. The power dissipation can be calculated using the formula: Pd = Vds * Ids, where Vds is the voltage drop across the device and Ids is the current flowing through it.
The recommended PCB layout for the STB60NF06T4 involves keeping the power traces short and wide, using a solid ground plane, and placing the device close to the power source. It's also recommended to use a thermal pad or a heat sink to improve heat dissipation.
Yes, the STB60NF06T4 can be used in switching applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) to prevent damage. The device can handle high-frequency switching, but the switching frequency should be limited to avoid overheating.
To protect the STB60NF06T4 from overvoltage and overcurrent, you can use a voltage regulator or a voltage clamp to limit the voltage across the device. Additionally, you can use a current sense resistor and a comparator to detect overcurrent conditions and shut down the device if necessary.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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