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STBB2J30-R - STMicroelectronics

Description: STMicroelectronics STBB2J30-R, Boost/Buck Converter 800mA, Adjustable, 1.2 → 4.5 V, 3 MHz, 20-Pin Flip-Chip

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STBB2J30-R - STMicroelectronics - PCB symbol
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PCB Footprints
STBB2J30-R - STMicroelectronics PCB footprint - BGA - BGA - Flip Chip 20
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3D Models
STBB2J30-R - STMicroelectronics - 3D model - BGA - Flip Chip 20
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STBB2J30-R Details

  • Manufacturer Part Number:

    STBB2J30-R

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    Flip Chip -20

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.4 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PBGA-B20

  • Length:

    2.06 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    3000 kHz

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.74 mm

STBB2J30-R Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STBB2J30-R). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly.
  • For EMI and EMC compliance, ensure that the PCB layout is designed to minimize radiation and susceptibility. Use a shielded enclosure, and consider using EMI filters or common-mode chokes on the input and output lines. Ensure that the device is properly decoupled, and use a low-ESR capacitor for the output filter. Follow the recommended layout guidelines for the device's pins and traces.
  • When selecting an output capacitor for the STBB2J30-R, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A low-ESR capacitor with a capacitance value between 10uF to 100uF and a voltage rating of at least 2x the output voltage is recommended. Ensure that the capacitor is placed close to the device and connected to the output pin.
  • For overcurrent protection, ensure that the device is operated within the recommended current rating. Use a current-sensing resistor or a dedicated overcurrent protection IC to monitor the output current. Implement a foldback current limit or a hiccup mode to prevent damage to the device and the load in case of an overcurrent event.

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STBB2J30-R Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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