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STC03DE170HV - STMicroelectronics

Description: Transistor Gate Driver NPN - Emitter Switched Bipolar 1700V (1.7kV) 3A Through Hole TO-247-4L HV

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STC03DE170HV - STMicroelectronics - PCB symbol
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STC03DE170HV - STMicroelectronics PCB footprint - Other - Other - STC03DE170HV-1
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STC03DE170HV - STMicroelectronics - 3D model - Other - STC03DE170HV-1
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STC03DE170HV Details

  • Manufacturer Part Number:

    STC03DE170HV

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247

  • Package Description:

    ROHS COMPLIANT, TO-247, 4 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Collector Current-Max (IC):

    3 A

  • Configuration:

    SINGLE WITH BUILT-IN FET AND DIODE

  • DC Current Gain-Min (hFE):

    10

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    100 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STC03DE170HV Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, ensure good thermal management, and consider using a heat sink or thermal pad to dissipate heat.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and ensure that the device is properly grounded during handling. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.
  • The recommended soldering conditions for the STC03DE170HV involve using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. Ensure the device is properly secured to the PCB to prevent movement during soldering.

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STC03DE170HV Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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