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STCH02TR - STMicroelectronics

Description: Offline PWM quasi resonant controller for ultra-low standby power supplies

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STCH02TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - ...SO-8 mechanical data888
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STCH02TR Details

  • Manufacturer Part Number:

    STCH02TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    SO-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    23 V

  • Input Voltage-Min:

    11.5 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2.7 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    260 kHz

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

STCH02TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the STCH02TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
  • To ensure reliable operation in high-temperature environments, ensure that the device is properly mounted on a heat sink or thermal pad, and that the PCB is designed to dissipate heat efficiently. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink. Finally, ensure that the device is operated within its recommended temperature range.
  • For EMI and RFI shielding, ensure that the PCB is designed with a solid ground plane, and that the device is placed in a shielded area. Use a metal shield or a Faraday cage to enclose the device, and ensure that all cables and connectors are properly shielded. Also, consider using EMI filters or common-mode chokes to reduce electromagnetic interference.
  • To troubleshoot issues with the device's thermal protection feature, check the device's thermal shutdown threshold and ensure that it is set correctly. Verify that the device is properly mounted on a heat sink or thermal pad, and that the PCB is designed to dissipate heat efficiently. Also, check for any signs of overheating, such as excessive current consumption or voltage drops.
  • To ensure the reliability and longevity of the STCH02TR, store the devices in their original packaging or in a dry, cool place. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body, avoiding touching the pins or leads. Use anti-static wrist straps or mats when handling the devices to prevent electrostatic discharge.

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STCH02TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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