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STF202-22T1G - onsemi

Description: Provides USB Line Termination, Filtering and ESD Protection; Single IC Offers Cost Savings by Replacing 3 Resistors, 2 Capacitors, and 5 TVs diodes; Bi-directional EMI Filtering Prevents Noise from Entering/Leaving the System; IEC61000-4-2 ESD Protection for USB Port; Flexible Pull-down or Pull-up Line Termination to Meet USB 1.1 Low Speed and High Speed Specification; TSOP-6 Package Minimizes PCB Space; Integrated Circuit Increases System Reliability versus Discrete Component Implementation; TVs Devices Pr

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PCB Footprints
STF202-22T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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3D Models
STF202-22T1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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STF202-22T1G Details

  • Manufacturer Part Number:

    STF202-22T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Approvals:

    IEC

  • Capacitance:

    68 µF

  • DC Resistance-Max:

    24 Ω

  • Filter Type:

    DATA LINE FILTER

  • Height:

    1.1 mm

  • JESD-609 Code:

    e3

  • Length:

    3.1 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Material:

    PLASTIC

  • Packing Method:

    TAPE AND REEL

  • Terminal Finish:

    MATTE TIN

  • Width:

    1.7 mm

STF202-22T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum rating. Monitor the device's thermal performance and adjust the system design as needed.
  • The STF202-22T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the STF202-22T1G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is suitable for use in harsh environments.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 3 reflows. Use a solder with a melting point of 217°C to 221°C.

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STF202-22T1G Overview

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