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STF5N62K3 - STMicroelectronics

Description: N-channel 620 V, 1.28 Ohm typ., 4.2 A SuperMESH3(TM) Power MOSFET in TO-220FP package

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STF5N62K3 - STMicroelectronics - PCB symbol
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PCB Footprints
STF5N62K3 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FP (1)
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STF5N62K3 - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220FP (1)
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STF5N62K3 Details

  • Manufacturer Part Number:

    STF5N62K3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    ULTRA LOW-ON RESISTANCE

  • Avalanche Energy Rating (Eas):

    120 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    620 V

  • Drain Current-Max (ID):

    4.2 A

  • Drain-source On Resistance-Max:

    1.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    16.8 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STF5N62K3 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the STF5N62K3 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general rule, it's recommended to operate the device within the specified voltage and current ratings to ensure safe operation.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Additionally, consider the device's gate-source voltage (Vgs) and drain-source voltage (Vds) ratings, as well as the recommended gate resistor value (Rg) to ensure stable operation.
  • For optimal thermal management, use a PCB layout that provides good thermal conductivity and heat dissipation. This can include using thermal vias, heat sinks, and thermal interface materials. Additionally, ensure that the device is mounted correctly and that the thermal pad is properly connected to the PCB.
  • To handle ESD protection, follow proper handling and storage procedures for the device. Use ESD-protective packaging and handling equipment, and ensure that the device is properly grounded during assembly and testing. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.
  • The reliability and lifetime expectations for the STF5N62K3 are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. Refer to the datasheet and relevant industry standards (e.g., JEDEC) for guidance on reliability and lifetime expectations. Additionally, consider performing accelerated life testing and reliability analysis to estimate the device's lifetime.

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STF5N62K3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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