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STG3820BJR - STMicroelectronics

Description: Low voltage high bandwidth quad DPDT switch

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STG3820BJR - STMicroelectronics - PCB symbol
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PCB Footprints
STG3820BJR - STMicroelectronics PCB footprint - BGA - BGA - .-- Mechanical data for Flip Chip 30 (2.0 x 2.4 x 0.625 mm) - 0.4 mm pitch
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3D Models
STG3820BJR - STMicroelectronics - 3D model - BGA - .-- Mechanical data for Flip Chip 30 (2.0 x 2.4 x 0.625 mm) - 0.4 mm pitch
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STG3820BJR Details

  • Manufacturer Part Number:

    STG3820BJR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    2 X 2.40 MM, 0.625 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, FLIP-CHIP-30

  • Pin Count:

    30

  • Country Of Origin:

    France

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    R-PBGA-B30

  • Number of Functions:

    4

  • Number of Terminals:

    30

  • On-state Resistance-Max (Ron):

    7.3 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA30,5X6,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    23 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

STG3820BJR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management strategy, such as a heat sink or thermal interface material, and ensure a maximum junction temperature (Tj) of 150°C. Monitor the device's thermal status using the thermal monitoring pin (TMP).
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input filter. The capacitor should be placed as close as possible to the VIN pin and have a low ESR (Equivalent Series Resistance) to minimize voltage ripple.
  • Use a 2nd-order LC filter with a 10uH to 22uH inductor and a 10uF to 22uF capacitor. The output filter should be designed to minimize the output voltage ripple and ensure a stable output voltage.
  • Keep the high-frequency switching nodes (e.g., LX, VIN, and VOUT) as short and direct as possible. Use a star-point connection for the switching nodes and avoid routing them near sensitive analog signals.

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STG3820BJR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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