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STGAP2HDMTR - STMicroelectronics

Description: Galvanically isolated 4 A dual gate driver

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STGAP2HDMTR - STMicroelectronics PCB footprint - Other - Other -  SSOP 32 LEAD 300 MIL PKG .0315  P
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STGAP2HDMTR Details

  • Manufacturer Part Number:

    STGAP2HDMTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-36/32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    14.45

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP32/36,.4,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    26 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    7.5 mm

STGAP2HDMTR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal pad connected to the ground plane to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including a proper thermal pad design, adequate heat sinking, and a maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.3V to 5V.
  • The STGAP2HDMTR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input signals. This ensures that the internal voltage regulators are properly initialized before the device starts operating.

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STGAP2HDMTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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