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STGAP2HSCMTR - STMicroelectronics

Description: Gate Drivers Galvanically isolated 4 A single gate driver

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STGAP2HSCMTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8W
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STGAP2HSCMTR - STMicroelectronics  - 3D model - Small Outline Packages - SO-8W
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STGAP2HSCMTR Details

  • Manufacturer Part Number:

    STGAP2HSCMTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Date Of Intro:

    2020-08-17

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    14

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    7.49 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.64 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.1 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    26 V

  • Supply Voltage1-Min:

    9.6 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    5.845 mm

STGAP2HSCMTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Monitor the device's thermal status using the built-in thermal sensor.
  • Handle the device in an ESD-protected environment, using wrist straps, mats, and packaging materials that meet the IEC 61340-5-1 standard. Ensure all personnel handling the device are grounded.
  • Use the device's power-saving modes, such as the low-power mode or shutdown mode, to reduce power consumption. Optimize the system's clock frequency and voltage supply to minimize power consumption.
  • Use a 10uF ceramic capacitor with a 10nF ceramic capacitor in parallel, placed as close as possible to the device's power pins. Ensure the capacitors are rated for the device's maximum operating voltage.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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STGAP2HSCMTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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