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STH272N6F7-6AG - STMicroelectronics

Description: Automotive-grade N-channel 60 V, 0.95 mΩ typ., 180 A STripFET™ F7 Power MOSFET in H²PAK-6 package

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STH272N6F7-6AG - STMicroelectronics PCB footprint - Other - Other - H²PAK-6
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STH272N6F7-6AG - STMicroelectronics  - 3D model - Other - H²PAK-6
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STH272N6F7-6AG Details

  • Manufacturer Part Number:

    STH272N6F7-6AG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    H2PAK-7/6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    1900 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    180 A

  • Drain-source On Resistance-Max:

    0.0015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    220 pF

  • JESD-30 Code:

    R-PSSO-G6

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    333 W

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STH272N6F7-6AG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STH272N6F7-6AG is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and ensure the device is operated within the specified voltage and current ranges.
  • For optimal thermal performance, use a multi-layer PCB with a thermal pad connected to a heat sink or a thermal interface material. Ensure good thermal conductivity and minimal thermal resistance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output pins to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Follow the recommended soldering temperature profile and rework conditions specified in the datasheet or in STMicroelectronics' application notes to prevent damage to the device.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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