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STH275N8F7-6AG - STMicroelectronics

Description: STMICROELECTRONICS - STH275N8F7-6AG - Power MOSFET, N Channel, 80 V, 180 A, 0.0017 ohm, H2PAK-6, Surface Mount

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STH275N8F7-6AG - STMicroelectronics - PCB symbol
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PCB Footprints
STH275N8F7-6AG - STMicroelectronics PCB footprint - Other - Other - H²PAK-6
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STH275N8F7-6AG - STMicroelectronics - 3D model - Other - H²PAK-6
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STH275N8F7-6AG Details

  • Manufacturer Part Number:

    STH275N8F7-6AG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    775 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    180 A

  • Drain-source On Resistance-Max:

    0.0021 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    236 pF

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    315 W

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STH275N8F7-6AG Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • The STH275N8F7-6AG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded.
  • Yes, the STH275N8F7-6AG is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is suitable for use in high-reliability systems.
  • STMicroelectronics recommends soldering the device using a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Ensure that the soldering process is performed in a nitrogen atmosphere to prevent oxidation.

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STH275N8F7-6AG Overview

Use the download button to access the STH275N8F7-6AG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like STH27, or try a keyword search, such as Power Field-Effect Transistors

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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