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STH410N4F7-6AG - STMicroelectronics

Description: Automotive-grade N-channel 40 V, 0.8 mΩ typ., 200 A STripFET™ F7 Power MOSFETs in H²PAK-2 and H²PAK-6 packages

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STH410N4F7-6AG - STMicroelectronics PCB footprint - Other - Other - H²PAK-6_1
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STH410N4F7-6AG Details

  • Manufacturer Part Number:

    STH410N4F7-6AG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    H2PAK-7/6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    BULK: 1000

  • Avalanche Energy Rating (Eas):

    1900 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    200 A

  • Drain-source On Resistance-Max:

    0.0011 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    390 pF

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    365 W

  • Pulsed Drain Current-Max (IDM):

    800 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STH410N4F7-6AG Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Use a shielded enclosure, keep sensitive analog circuits away from the STH410N4F7-6AG, and consider adding EMI filters or ferrite beads to the power supply lines.
  • Yes, but ensure you follow STMicroelectronics' guidelines for high-reliability design, and consider using redundant systems, error detection, and correction mechanisms to ensure fault tolerance.
  • Use a logic analyzer or oscilloscope to monitor signals, check for proper power supply and decoupling, and consult STMicroelectronics' application notes and technical support resources.

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STH410N4F7-6AG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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