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STI270N4F3 - STMicroelectronics

Description: STMicroelectronics STI270N4F3 N-channel MOSFET Transistor, 120 A, 40 V, 3-Pin I2PAK

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STI270N4F3 - STMicroelectronics - PCB symbol
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PCB Footprints
STI270N4F3 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - I2PAK (TO-262)
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3D Models
STI270N4F3 - STMicroelectronics - 3D model - Transistor Outline, Vertical - I2PAK (TO-262)
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STI270N4F3 Details

  • Manufacturer Part Number:

    STI270N4F3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-262AA

  • Package Description:

    I2PAK-3

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    47 pF

  • JEDEC-95 Code:

    TO-262AA

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    330 W

  • Pulsed Drain Current-Max (IDM):

    480 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STI270N4F3 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal pad connection, copper pour, and via placement to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust cooling system. Additionally, consider using a thermal monitoring system to detect potential overheating issues.
  • Although the datasheet specifies a recommended operating voltage range, the absolute maximum rating for the VCC pin is 4.5V. Exceeding this voltage can cause permanent damage to the device.
  • The STI270N4F3 requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is VCC, then AVCC, and finally DVCC. A power-down sequence in the reverse order is recommended to prevent latch-up or other issues.
  • The NC pins on the STI270N4F3 are not internally connected and should be left unconnected or tied to a fixed voltage (e.g., GND) to prevent noise and ensure reliable operation.

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STI270N4F3 Overview

Use the download button to access the STI270N4F3 schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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