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STLVD111BFR - STMicroelectronics

Description: Programmable low voltage 1:10 differential LVDS clock driver

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STLVD111BFR - STMicroelectronics - PCB symbol
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PCB Footprints
STLVD111BFR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP32
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STLVD111BFR - STMicroelectronics - 3D model - Quad Flat Packages - TQFP32
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STLVD111BFR Details

  • Manufacturer Part Number:

    STLVD111BFR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    TQFP-32

  • Pin Count:

    32

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Family:

    111

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    235

  • Prop. Delay@Nom-Sup:

    3 ns

  • Propagation Delay (tpd):

    2.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

STLVD111BFR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. Ensure a minimum of 1mm clearance around the device for airflow.
  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans, to keep the device temperature below 125°C. Monitor the device's junction temperature (TJ) and adjust the system design accordingly.
  • Exceeding the recommended operating conditions can lead to reduced lifespan, increased thermal resistance, and potential device failure. Ensure that the device operates within the specified voltage, current, and temperature ranges.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly decoupled and that the input capacitor is of sufficient value. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • The STLVD111BFR has built-in ESD protection. However, it's essential to follow proper handling and assembly procedures to prevent damage. Implement latch-up prevention measures, such as using a latch-up immune design and ensuring that the device is not exposed to excessive voltage or current.

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STLVD111BFR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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