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STM32F407ZET6TR - STMicroelectronics

Description: Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera

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STM32F407ZET6TR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144 package information.
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STM32F407ZET6TR - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP144 package information.
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STM32F407ZET6TR Details

  • Manufacturer Part Number:

    STM32F407ZET6TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    114

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    200704

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    168 MHz

  • Supply Current-Max:

    102 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F407ZET6TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the STM32F407ZET6TR is -40°C to 105°C (industrial grade) and -40°C to 125°C (extended grade).
  • The clock speed of the STM32F407ZET6TR can be configured using the Clock Control Register (RCC) and the Power Management Unit (PMU). The clock speed can be set to 16 MHz, 32 kHz, or an external clock source.
  • The maximum current consumption of the STM32F407ZET6TR is approximately 350 mA at 3.3V and 25°C, depending on the operating mode and peripherals used.
  • The STM32F407ZET6TR can be programmed using a variety of tools, including the STMicroelectronics STM32CubeMX software, Keil µVision, IAR Embedded Workbench, and the GNU ARM Embedded Toolchain.
  • The main difference between the STM32F407ZET6TR and the STM32F407VG is the package type. The STM32F407ZET6TR is a LQFP144 package, while the STM32F407VG is a LQFP100 package. The STM32F407ZET6TR has more pins and a larger package size.

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STM32F407ZET6TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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