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STM32F723IET6 - STMicroelectronics

Description: Arm® Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 512KB Flash 256+16+4KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF

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STM32F723IET6 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP176
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STM32F723IET6 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP176
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STM32F723IET6 Details

  • Manufacturer Part Number:

    STM32F723IET6

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-176

  • Manufacturer Package Code:

    LQFP 176 24x24x1.4

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    26 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    138

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    176

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    216 MHz

  • Supply Current-Max:

    180 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32F723IET6 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32F723IET6 is 216 MHz, but it can be overclocked to 240 MHz with a reduced voltage supply.
  • To achieve the highest clock frequency, you need to configure the clock tree to use the HSE (High-Speed External) clock source, and then multiply it using the PLL (Phase-Locked Loop) to reach the desired frequency. Refer to the STM32F7 clock tree configuration application note for more details.
  • The STM32F723IET6 has 512 KB of Flash memory and 256 KB of SRAM (including 64 KB of CCM - Core Coupled Memory).
  • To use the DMA controller, you need to configure the DMA channel, set the source and destination addresses, and enable the DMA transfer. You can use the STM32CubeF7 firmware library to simplify the process. Refer to the STM32F7 DMA application note for more details.
  • The Boot pins (BOOT0 and BOOT1) are used to select the boot mode of the microcontroller. They can be used to select between different boot modes, such as booting from Flash memory, SRAM, or an external memory device.

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STM32F723IET6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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