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STM32G474MCT3 - STMicroelectronics

Description: Mainstream Arm Cortex-M4+ MCU 170MHz with 256Kbytes of Flash memory, Math Accelerator, HR Timer, High Analog level integration

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STM32G474MCT3 - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP 80 12x12x1.4 mm-1
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STM32G474MCT3 - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP 80 12x12x1.4 mm-1
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STM32G474MCT3 Details

  • Manufacturer Part Number:

    STM32G474MCT3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-80

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-03-31

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    66

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    80

  • Number of Timers:

    15

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP80,.55SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (bytes):

    131072

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    170 MHz

  • Supply Current-Max:

    42 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32G474MCT3 Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with the internal oscillator (HSI) is 64 MHz. However, it's recommended to use the PLL to achieve higher frequencies up to 170 MHz.
  • To achieve the highest performance, configure the clock tree to use the PLL as the clock source, and set the PLL multiplication factor to 17 to achieve a clock frequency of 170 MHz. Also, ensure that the Flash memory is configured to run at the highest possible frequency.
  • The maximum amount of current that can be sourced or sunk by the GPIO pins is 20 mA. However, it's recommended to limit the current to 10 mA to ensure reliable operation and to prevent overheating.
  • To implement a low-power mode, use the STOP or STANDBY modes, which can reduce power consumption to as low as 2.5 μA. Additionally, use the PWR clock gate to disable clocks to unused peripherals, and use the voltage regulator to reduce the voltage supply to the core and peripherals.
  • The STM32G474MCT3 has 512 KB of Flash memory, which can store up to 512 KB of code and data. However, it's recommended to leave some space for the bootloader and for future firmware updates.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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