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STM32L552CET6P - STMicroelectronics

Description: Ultra-low-power Arm® Cortex®-M33 32-bit MCU+TrustZone®+FPU, 165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS

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STM32L552CET6P - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline
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STM32L552CET6P - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline
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STM32L552CET6P Details

  • Manufacturer Part Number:

    STM32L552CET6P

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-48

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2019-12-23

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M33

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    14

  • Number of External Interrupts:

    43

  • Number of I/O Lines:

    36

  • Number of Serial I/Os:

    9

  • Number of Terminals:

    48

  • Number of Timers:

    15

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    393216

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    110 MHz

  • Supply Current-Max:

    31.38 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

STM32L552CET6P Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the STM32L552CET6P is 110 MHz, but it can be overclocked to 120 MHz with a reduced voltage supply (VDD) of 1.14 V.
  • The internal voltage regulator (VREG) on the STM32L552CET6P can be configured using the PWR_VREGx registers. The VREG can be set to one of three modes: Low Power Mode (LP), Medium Power Mode (MP), and High Power Mode (HP). The default mode is LP.
  • The maximum current consumption of the STM32L552CET6P depends on the operating mode and frequency. In Run mode at 110 MHz, the maximum current consumption is around 350 mA. In Low Power Run mode at 32 kHz, the maximum current consumption is around 20 mA.
  • The internal flash memory on the STM32L552CET6P can be accessed using the FLASH registers. The flash memory is divided into two banks, each with its own set of registers. The flash memory can be programmed using the STM32CubeMX software or by writing custom code using the STM32 HAL library.
  • The Boot pins (BOOT0 and BOOT1) on the STM32L552CET6P are used to select the boot mode of the device. BOOT0 and BOOT1 can be used to select between the internal flash memory, system memory, or an external memory device as the boot source.

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STM32L552CET6P Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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