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STM32MP135AAF3 - STMicroelectronics

Description: Arm® Cortex®-A7 up to 1 GHz, LCD-TFT, camera interface, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio

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STM32MP135AAF3 - STMicroelectronics PCB footprint - BGA - BGA - TFBGA 11X11 320L PITCH 0.5 MM-1
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STM32MP135AAF3 - STMicroelectronics  - 3D model - BGA - TFBGA 11X11 320L PITCH 0.5 MM-1
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STM32MP135AAF3 Details

  • Manufacturer Part Number:

    STM32MP135AAF3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    48 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B320

  • JESD-609 Code:

    e2

  • Length:

    11 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    56

  • Number of Serial I/Os:

    10

  • Number of Terminals:

    320

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA320,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • RAM (words):

    172032

  • Seated Height-Max:

    1.2 mm

  • Speed:

    650 MHz

  • Supply Current-Max:

    239 mA

  • Supply Voltage-Max:

    1.38 V

  • Supply Voltage-Min:

    1.21 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

STM32MP135AAF3 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to first power up the VDD_CORE and VDD_PLL domains, followed by the VDD_DDR domain. This ensures that the internal regulators are properly enabled and the DDR memory is initialized correctly.
  • The clock tree configuration involves setting up the PLLs, clock dividers, and clock gates. The STM32CubeMX tool can be used to generate the clock configuration code, or the registers can be programmed manually using the STM32MP135AAF3 reference manual.
  • The maximum operating frequency of the STM32MP135AAF3 is 650 MHz, but this can be limited by the specific use case, thermal design, and power consumption constraints.
  • Power consumption can be optimized by using the low-power modes (Sleep, Stop, and Standby), reducing the clock frequency, turning off unused peripherals, and using the dynamic voltage and frequency scaling (DVFS) feature.
  • The main difference is that the STM32MP135AAF3 has a single-core Arm Cortex-A7 processor, while the STM32MP157AAF3 has a dual-core Arm Cortex-A7 processor. The STM32MP157AAF3 also has more peripherals and a higher maximum operating frequency.

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STM32MP135AAF3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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