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STM32MP157DAC1 - STMicroelectronics

Description: Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog

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STM32MP157DAC1 - STMicroelectronics - PCB symbol
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STM32MP157DAC1 - STMicroelectronics PCB footprint - Other - Other - STM32MP157DAC1-6
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STM32MP157DAC1 Details

  • Manufacturer Part Number:

    STM32MP157DAC1

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    64 MHz

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B361

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    48

  • Number of Terminals:

    361

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RAM (words):

    724992

  • Seated Height-Max:

    1.2 mm

  • Speed:

    800 MHz

  • Supply Current-Max:

    865 mA

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    0.85 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

STM32MP157DAC1 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_CORE and VDD_PLL first, followed by the VDD_DDR, and finally the VDD_IO. This ensures that the internal regulators and PLL are stable before the DDR memory and I/Os are powered up.
  • The clock tree should be configured to use the HSE (High-Speed External) clock as the source, and then divide it down to generate the necessary clock frequencies for the CPU, peripherals, and DDR memory. The STM32CubeMX tool can be used to generate the clock configuration code.
  • The maximum frequency for the DDR memory interface is 533 MHz, but it can be overclocked to 667 MHz with careful tuning of the memory timings and voltage settings.
  • Secure boot can be implemented using the built-in ROM code and the STM32CubeMX tool. The ROM code provides a secure boot mechanism that verifies the authenticity of the firmware using digital signatures. The STM32CubeMX tool can be used to generate the secure boot code and configure the necessary settings.
  • The STM32MP157DAC1 can address up to 1 GB of RAM, but the actual amount of RAM that can be used depends on the specific configuration and memory mapping. Typically, 512 MB or 1 GB of RAM is used with this device.

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STM32MP157DAC1 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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