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STM32MP255CAL3 - STMicroelectronics

Description: MPU with Dual Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 2xEthernet, 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA

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STM32MP255CAL3 - STMicroelectronics - PCB symbol
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PCB Footprints
STM32MP255CAL3 - STMicroelectronics PCB footprint - BGA - BGA - VFBGA361 - Outline **
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3D Models
STM32MP255CAL3 - STMicroelectronics - 3D model - BGA - VFBGA361 - Outline **
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STM32MP255CAL3 Details

  • Manufacturer Part Number:

    STM32MP255CAL3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-361

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Additional Feature:

    USB3.0

  • Bit Size:

    64

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    48 MHz

  • Format:

    FLOATING-POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B361

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    52

  • Number of Serial I/Os:

    13

  • Number of Terminals:

    361

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA361,19X19,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • RAM (words):

    827392

  • Seated Height-Max:

    1 mm

  • Speed:

    400 MHz

  • Supply Current-Max:

    1200 mA

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

STM32MP255CAL3 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to power up the VDD_CORE, VDD_PLL, and VDD_DDR simultaneously, followed by the VDD_IO and VDD_USB. This ensures proper initialization of the device.
  • The clock tree can be configured using the Clock Control Register (CCR) and the PLL Clock Register (PLLCKR). The CCR is used to select the clock source, while the PLLCKR is used to configure the PLL settings. Refer to the STM32MP255CAL3 Reference Manual for more details.
  • The maximum operating frequency of the STM32MP255CAL3 is 650 MHz, but this can be limited by the specific use case and thermal considerations. It's recommended to consult the datasheet and application notes for more information.
  • Secure boot can be implemented using the STM32MP255CAL3's built-in security features, such as the BootROM and the Secure Firmware Installation (SFI) mechanism. Refer to the STM32MP255CAL3 Security Manual for more details.
  • The main difference between the two devices is the amount of on-chip memory. The STM32MP255CAL3 has 512 KB of SRAM and 128 KB of ROM, while the STM32MP257CAL3 has 1 MB of SRAM and 256 KB of ROM. The STM32MP257CAL3 also has additional peripherals and features.

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STM32MP255CAL3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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