STMPE1801BJR - STMicroelectronics

STMPE1801BJR Details

• Manufacturer Part Number:

  STMPE1801BJR

• Brand Name:

  STMicroelectronics

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  FLIP CHIP CSP-25

• Pin Count:

  25

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Manufacturer:

  STMicroelectronics

• YTEOL:

  0

• Clock Frequency-Max:

  0.032 MHz

• JESD-30 Code:

  S-PBGA-B25

• JESD-609 Code:

  e1

• Length:

  2 mm

• Number of Bits:

  18

• Number of I/O Lines:

  18

• Number of Ports:

  2

• Number of Terminals:

  25

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA25,5X5,16

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  235

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.66 mm

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.65 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  2 mm

• uPs/uCs/Peripheral ICs Type:

  PARALLEL IO PORT, GENERAL PURPOSE