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STP150NF04 - STMicroelectronics

Description: N-channel 40 V, 0.005 Ω typ., 80 A STripFET™II Power MOSFET in a TO-220 package

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STP150NF04 - STMicroelectronics - PCB symbol
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PCB Footprints
STP150NF04 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220_2022
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3D Models
STP150NF04 - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220_2022
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STP150NF04 Details

  • Manufacturer Part Number:

    STP150NF04

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    80 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Operating Temperature-Max:

    175 °C

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STP150NF04 Frequently Asked Questions (FAQs)

  • The maximum junction temperature (Tj) of the STP150NF04 is 175°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 150°C for reliable operation and to prevent thermal runaway.
  • To calculate the power dissipation of the STP150NF04, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance from junction to ambient (RthJA). The power dissipation (Pd) can be calculated using the formula: Pd = (Vin - Vout) x Iout x RthJA. Make sure to check the datasheet for the specific values of RthJA and the maximum allowed power dissipation.
  • To minimize thermal resistance, it's recommended to use a PCB layout that provides a large copper area for heat dissipation. Place the device near a thermal pad or a heat sink, and ensure that there are no thermal barriers (such as solder mask or silkscreen) between the device and the copper area. Also, use multiple vias to connect the copper area to the inner layers of the PCB to improve heat dissipation.
  • The STP150NF04 is a low-dropout linear voltage regulator, which means it's not suitable for high-frequency switching applications. It's designed for low-frequency, low-noise applications such as audio and battery-powered devices. If you need a high-frequency switching regulator, consider using a different device, such as a switching regulator from STMicroelectronics or another manufacturer.
  • To ensure the stability of the STP150NF04 output voltage, make sure to use a suitable output capacitor with a low equivalent series resistance (ESR). The recommended output capacitor value is 10uF, but you may need to adjust this value depending on your specific application. Also, ensure that the input voltage is stable and within the recommended range, and that the device is operated within its specified temperature range.

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STP150NF04 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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