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STP85N3LH5 - STMicroelectronics

Description: STMICROELECTRONICS - STP85N3LH5 - MOSFET, N CH, 30V, 80A, TO-220

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STP85N3LH5 - STMicroelectronics - PCB symbol
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PCB Footprints
STP85N3LH5 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 TYPE A_1
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3D Models
STP85N3LH5 - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220 TYPE A_1
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STP85N3LH5 Details

  • Manufacturer Part Number:

    STP85N3LH5

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, TO-220, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    165 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.0071 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    70 W

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STP85N3LH5 Frequently Asked Questions (FAQs)

  • A good PCB layout for the STP85N3LH5 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device. This helps to reduce thermal resistance and ensures efficient heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The recommended soldering conditions for the STP85N3LH5 are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's also essential to use a solder with a melting point above 217°C.
  • To protect the STP85N3LH5 from ESD, it's essential to follow proper handling and storage procedures, such as using ESD-safe packaging, wrist straps, and mats. Additionally, ensure that the device is powered down during handling and storage.
  • Operating the STP85N3LH5 beyond the recommended maximum junction temperature can lead to reduced reliability, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to ensure optimal performance and reliability.

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STP85N3LH5 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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