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STPS10120CFP - STMicroelectronics

Description: 120 V power Schottky rectifier

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STPS10120CFP - STMicroelectronics - PCB symbol
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PCB Footprints
STPS10120CFP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB package mechanical data
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3D Models
STPS10120CFP - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB package mechanical data
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STPS10120CFP Details

  • Manufacturer Part Number:

    STPS10120CFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220FPAB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    POWER

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.96 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    6 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS10120CFP Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended operating conditions. Also, consider derating the device's power dissipation at high temperatures.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close as possible to the VIN pin. This helps to filter out noise and ensure stable operation.
  • Yes, the STPS10120CFP is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Check the input voltage, output current, and thermal conditions. Verify that the device is properly soldered and that the PCB layout meets the recommended guidelines. Use a thermal camera or thermometer to monitor the device's temperature.

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STPS10120CFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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