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STPS1045SFY - STMicroelectronics

Description: Automotive 45 V, 10 A PSMC Power Schottky Rectifier,Tj(max.):175 °C,VF (typ.): 0.51 V.

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PCB Footprints
STPS1045SFY - STMicroelectronics PCB footprint - Other - Other - PSMC (TO-277A)
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3D Models
STPS1045SFY - STMicroelectronics  - 3D model - Other - PSMC (TO-277A)
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STPS1045SFY Details

  • Manufacturer Part Number:

    STPS1045SFY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 3 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2018-08-16

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.98

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.62 V

  • JEDEC-95 Code:

    TO-277A

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    210 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

STPS1045SFY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS1045SFY). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly.
  • The recommended soldering conditions for the STPS1045SFY are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/second. Use a soldering iron with a temperature range of 200-250°C, and ensure that the device is not exposed to excessive thermal stress.
  • To handle the device's power dissipation, ensure that the PCB is designed to dissipate heat efficiently. Use a heat sink or thermal pad, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly. Consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an anti-static wrist strap. Store the device in an anti-static bag or wrap it in anti-static material. Use an ESD-protected workstation and ensure that all equipment is properly grounded. Avoid touching the device's pins or exposing it to high-voltage sources.

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STPS1045SFY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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