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STPS1150AFN - STMicroelectronics

Description: 150 V, 1 A Power Schottky Rectifier

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STPS1150AFN - STMicroelectronics - PCB symbol
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STPS1150AFN - STMicroelectronics PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SMA Flat Notch
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STPS1150AFN - STMicroelectronics - 3D model - Small Outline Diode Flat Lead - SMA Flat Notch
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STPS1150AFN Details

  • Manufacturer Part Number:

    STPS1150AFN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS1150AFN Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, keep the junction temperature (Tj) below 150°C, and follow the recommended derating curves for voltage and current. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the gate driver output is 20V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, the STPS1150AFN can be used in a half-bridge configuration. However, ensure that the bootstrap diode is properly sized to handle the required current and voltage.
  • The minimum input capacitance required for the bootstrap circuit can be calculated using the formula: CBootstrap = (VCC x Ipeak) / (fsw x Vripple), where VCC is the input voltage, Ipeak is the peak current, fsw is the switching frequency, and Vripple is the allowed voltage ripple.

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STPS1150AFN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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