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STPS1150AY - STMicroelectronics

Description: Schottky Diodes & Rectifiers Auto pwr Schottky 1A 150V VRRM 0.67V

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PCB Footprints
STPS1150AY - STMicroelectronics PCB footprint - Diodes Moulded - Diodes Moulded - SMA-ren2
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3D Models
STPS1150AY - STMicroelectronics  - 3D model - Diodes Moulded - SMA-ren2
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STPS1150AY Details

  • Manufacturer Part Number:

    STPS1150AY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.07

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.89 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STPS1150AY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS1150AY). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly.
  • The recommended soldering conditions for the STPS1150AY are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/second. Ensure that the soldering process is lead-free and RoHS-compliant.
  • To handle the device's power dissipation, ensure that the PCB is designed to dissipate heat efficiently. Use a heat sink or thermal pad, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly. Consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The STPS1150AY has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Ensure that the device is handled in an ESD-protected environment, and use ESD-protective packaging and materials.

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STPS1150AY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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